In a landmark move for India’s technology and manufacturing ambitions, the central government approved a semiconductor fabrication facility in YEIDA (Yamuna Expressway Industrial Development Authority) region, near Jewar Airport in Uttar Pradesh.
Project Highlights:
Joint Venture Partners: Indian IT major HCL Group and Taiwanese electronics giant Foxconn
Production Capacity: The fab will handle 20,000 semiconductor wafers per month
Location Advantage: Situated near the upcoming Jewar Airport, which will be Asia’s largest upon completion, offering logistics and connectivity benefits
This fab will primarily manufacture mature-node chips (likely 28nm and above), essential for products like automobiles, home appliances, telecom equipment, and EV batteries — segments where India is aiming for self-sufficiency.
Strategic Significance:
India currently imports over 90% of its semiconductor needs, creating a major supply chain vulnerability. This facility aligns with the government’s Rs76,000 crore semiconductor mission, and will likely spur growth in the entire electronics manufacturing ecosystem — from chip design to packaging.
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